|
|
Legal status
Patent not validated
| (51) | INT.CL. | C09K 3/14 | |
| C09G 1/02 | |||
| H01L 21/3105 | |||
| C09K 13/00 |
| (11) | Number of the document | 2428541 |
| (13) | Kind of document | T |
| (96) | European patent application number | 11179985.4 |
| Date of filing the European patent application | 2011-09-05 | |
| (97) | Date of publication of the European application | 2012-03-14 |
| (45) | Date of publication and mention of the grant of the patent | 2019-03-06 |
| (46) | Date of publication of the claims translation |
| (30) | Number | Date | Country code |
| 380719 P | 2010-09-08 | US |
| (72) |
Li, Yuzhuo, DE
Chu, Jea-Ju, TW
Venkataraman, Shyam Sundar, TW
Chiu, Wei Lan William, TW
Pinder, Harvey Wayne, US
|
| (73) |
BASF SE,
Carl-Bosch-Strasse 38, 67056 Ludwigshafen am Rhein,
DE
|
| (54) | Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films |
| Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films |