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Legal status
Patent not validated
| (51) | INT.CL. | C08L 79/02 | |
| H01L 21/288 | |||
| H01L 21/768 | |||
| C25D 3/02 | |||
| C25D 3/38 | |||
| C25D 5/02 | |||
| C25D 7/12 | |||
| C08G 73/02 | |||
| H05K 3/42 |
| (11) | Number of the document | 2504396 |
| (13) | Kind of document | T |
| (96) | European patent application number | 10782262.9 |
| Date of filing the European patent application | 2010-11-22 | |
| (97) | Date of publication of the European application | 2012-10-03 |
| (45) | Date of publication and mention of the grant of the patent | 2021-02-24 |
| (46) | Date of publication of the claims translation |
| (86) | Number | PCT/EP2010/067874 |
| Date | 2010-11-22 |
| (87) | Number | WO 2011/064154 |
| Date | 2011-06-03 |
| (30) | Number | Date | Country code |
| 264705 P | 2009-11-27 | US |
| (72) |
RÖGER-GÖPFERT, Cornelia, DE
RAETHER, Roman Benedikt, DE
MAYER, Dieter, DE
EMNET, Charlotte, DE
ARNOLD, Marco, DE
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| (73) |
BASF SE,
Carl-Bosch-Strasse 38, 67056 Ludwigshafen am Rhein,
DE
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| (54) | COMPOSITION FOR COPPER ELECTROPLATING COMPRISING LEVELING AGENT |
| COMPOSITION FOR COPPER ELECTROPLATING COMPRISING LEVELING AGENT |