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Legal status
Patent not validated
| (51) | INT.CL. | B23K 26/20 | |
| C03B 23/20 | |||
| B23K 103/18 |
| (11) | Number of the document | 2776205 |
| (13) | Kind of document | T |
| (96) | European patent application number | 12846875.8 |
| Date of filing the European patent application | 2012-11-07 | |
| (97) | Date of publication of the European application | 2014-09-17 |
| (45) | Date of publication and mention of the grant of the patent | 2018-07-18 |
| (46) | Date of publication of the claims translation |
| (86) | Number | PCT/US2012/063977 |
| Date | 2012-11-07 |
| (87) | Number | WO 2013/070791 |
| Date | 2013-05-16 |
| (30) | Number | Date | Country code |
| 201113291956 | 2011-11-08 | US |
| (72) |
KARAM, Raymond, Miller, US
ROUSSOS, Georges, US
FINKLE, Mark, US
HARVEY, Daniella, M., US
ACKERMAN-KARAM, Pascal, R., US
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| (73) |
PICOSYS INCORPORATED,
A Corporation of The State of California -, Dba Invenios., 320N. Nopal St.,, Santa Barbara, CA 93103,
US
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| (54) | ROOM TEMPERATURE GLASS-TO-GLASS, GLASS-TO-PLASTIC AND GLASS-TO-CERAMIC/SEMICONDUCTOR BONDING |
| ROOM TEMPERATURE GLASS-TO-GLASS, GLASS-TO-PLASTIC AND GLASS-TO-CERAMIC/SEMICONDUCTOR BONDING |