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Legal status
Patent not validated
| (51) | INT.CL. | C09D 183/10 | |
| C09D 5/00 | |||
| C09D 7/40 |
| (11) | Number of the document | 3275955 |
| (13) | Kind of document | T |
| (96) | European patent application number | 16754994.8 |
| Date of filing the European patent application | 2016-02-23 | |
| (97) | Date of publication of the European application | 2018-01-31 |
| (45) | Date of publication and mention of the grant of the patent | 2020-05-27 |
| (46) | Date of publication of the claims translation |
| (86) | Number | PCT/JP2016/000960 |
| Date | 2016-02-23 |
| (87) | Number | WO 2016/136244 |
| Date | 2016-09-01 |
| (30) | Number | Date | Country code |
| 2015037452 | 2015-02-26 | JP |
| (72) |
YAMAZAKI, Ryosuke, JP
YOSHIDA, Hiroaki, JP
YOSHIDA, Shin, JP
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| (73) |
Dow Toray Co., Ltd.,
2-24, Higashishinagawa 2-chome, Shinagawa-ku,, Tokyo,
JP
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| (54) | ELECTRIC/ELECTRONIC PART AND BONDING METHOD |
| ELECTRIC/ELECTRONIC PART AND BONDING METHOD |