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Legal status
Patent not validated
| (51) | INT.CL. | H01L 23/13 | (2006.01) |
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| (11) | Number of the document | 3761351 |
| (13) | Kind of document | T |
| (96) | European patent application number | 19760099.2 |
| Date of filing the European patent application | 2019-02-26 | |
| (97) | Date of publication of the European application | 2021-01-06 |
| (45) | Date of publication and mention of the grant of the patent | 2024-01-17 |
| (46) | Date of publication of the claims translation |
| (86) | Number | PCT/JP2019/007268 |
| Date | 2019-02-26 |
| (87) | Number | WO 2019/167931 |
| Date | 2019-09-06 |
| (30) | Number | Date | Country code |
| 2018037269 | 2018-03-02 | JP |
| (72) |
KITAHARA, Takeshi , JP
YUMOTO, Ryohei , JP
NAGATOMO, Yoshiyuki , JP
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| (73) |
Mitsubishi Materials Corporation ,
2-3, Marunouchi 3-chome,
Chiyoda-ku, Tokyo 100-8117,
JP
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| (54) | INSULATED CIRCUIT BOARD |
| INSULATED CIRCUIT BOARD |