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LT - COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES
EN - COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES

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Bibliographic data
Indications of the International Patent Classification (IPC)
(51) INT.CL. C25D 3/38
C23C 18/38
C08L 79/02
C08G 73/02
C25D 7/12
H01L 21/768
H01L 21/288
European patent
(11) Number of the document 2714807
(13) Kind of document T
(96) European patent application number 12792059.3
Date of filing the European patent application 2012-05-31
(97) Date of publication of the European application 2014-04-09
(45) Date of publication and mention of the grant of the patent 2019-01-02
(46) Date of publication of the claims translation
PCT application
(86) Number PCT/IB2012/052727
Date 2012-05-31
PCT application publication
(87) Number WO 2012/164509
Date 2012-12-06
Priority applications
(30) Number Date Country code
201161491935 P 2011-06-01 US
Inventors
(72)
RÖGER-GÖPFERT, Cornelia, DE
ARNOLD, Marco, DE
FLÜGEL, Alexander, DE
EMNET, Charlotte, DE
RAETHER, Roman, Benedikt, DE
MAYER, Dieter, DE
Grantee
(73) BASF SE, Carl-Bosch-Strasse 38, 67056 Ludwigshafen am Rhein, DE
Title
(54) COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES
  COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES
Last update date 2021-04-30