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LT - WAFER TEMPORARY BONDING METHOD AND THIN WAFER MANUFACTURING METHOD

EN - WAFER TEMPORARY BONDING METHOD AND THIN WAFER MANUFACTURING METHOD

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Bibliographic data

Indications of the International Patent Classification (IPC)
(51)	INT.CL.	H01L 21/683
		C09J 7/02
		B24B 37/30

European patent
(11)	Number of the document	3038148
(13)	Kind of document	T
(96)	European patent application number	15201534.3
	Date of filing the European patent application	2015-12-21
(97)	Date of publication of the European application	2016-06-29
(45)	Date of publication and mention of the grant of the patent	2017-08-02
(46)	Date of publication of the claims translation

Priority applications
(30)	Number	Date	Country code
	2014259813	2014-12-24	JP

Inventors
(72)	YASUDA, Hiroyuki, JP SUGO, Michihiro, JP TAGAMI, Shohei, JP TANABE, Masahito, JP

Grantee
(73)	Shin-Etsu Chemical Co., Ltd., 6-1, Ohtemachi 2-chome Chiyoda-ku, Tokyo, JP

Title
(54)	WAFER TEMPORARY BONDING METHOD AND THIN WAFER MANUFACTURING METHOD
	WAFER TEMPORARY BONDING METHOD AND THIN WAFER MANUFACTURING METHOD