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Teisinis statusas
Patentas neįsigaliojo (pagal EPK)
| (51) | INT.CL. | H01L 21/683 | |
| C09J 7/02 | |||
| B24B 37/30 |
| (11) | Patento numeris | 3038148 |
| (13) | Dokumento rūšis | T |
| (96) | Europos patento paraiškos numeris | 15201534.3 |
| Europos patento paraiškos padavimo data | 2015-12-21 | |
| (97) | Europos patento paraiškos paskelbimo data | 2016-06-29 |
| (45) | Paskelbimo apie Europos patento išdavimą data | 2017-08-02 |
| (46) | Apibrėžties vertimo paskelbimo data |
| (30) | Numeris | Data | Šalis |
| 2014259813 | 2014-12-24 | JP |
| (72) |
YASUDA, Hiroyuki, JP
SUGO, Michihiro, JP
TAGAMI, Shohei, JP
TANABE, Masahito, JP
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| (73) |
Shin-Etsu Chemical Co., Ltd.,
6-1, Ohtemachi 2-chome Chiyoda-ku, Tokyo,
JP
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| (54) | WAFER TEMPORARY BONDING METHOD AND THIN WAFER MANUFACTURING METHOD |
| WAFER TEMPORARY BONDING METHOD AND THIN WAFER MANUFACTURING METHOD |