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LT - STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES
EN - STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES

Legal status

Patent not validated

Bibliographic data
Indications of the International Patent Classification (IPC)
(51) INT.CL. G03F 7/42
C11D 7/26
C11D 7/32
C11D 7/50
C11D 7/10
European patent
(11) Number of the document 3249470
(13) Kind of document T
(96) European patent application number 17172498.2
Date of filing the European patent application 2017-05-23
(97) Date of publication of the European application 2017-11-29
(45) Date of publication and mention of the grant of the patent 2019-04-03
(46) Date of publication of the claims translation
Priority applications
(30) Number Date Country code
201662340204 P 2016-05-23 US
Inventors
(72)
SUGISHIMA, Yasuo, US
MIZUTANI, Atsushi, BE
WOJTCZAK, William A., US
Grantee
(73) FUJIFILM Electronic Materials U.S.A, Inc., 80 Circuit Drive, North Kingstown RI 02852, US
Title
(54) STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES
  STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES